Electronic Display

Flat panel display is a fast-evolving, innovative market. Consumer and industrial device manufacturers are constantly striving for better image quality and display resolution. As the industry continues to innovate with different display technologies (LCD and OLED), customers’ flat panel display bonding material requirements are becoming more sophisticated and challenging.

H.B. Fuller’s range of flat panel display adhesives enable display manufacturers to meet their current and next generation panel bonding needs. Our low temperature cure reactive film product chemistries offer the adhesion of a reactive system that cannot be achieved by PSA films while also eliminating the high cure temperatures of traditional reactive film solutions. In addition, our liquid adhesives for display manufacturing offer both UV (command cure) capabilities as well as industry-leading thermal cure kinetics, depending on the specific requirements for each application.

H.B. Fuller’s adhesive materials for display manufacturing applications typically offer:

• Low temperature thermal or command cure capabilities
• Short cure times
• Low stress bonds
• Low shrinkage
• Low weight loss
• High adhesion
• High elongation
• High reliability
• Controlled flow

Typical applications served by the existing product range are:

• Chip on Glass (COG) protection
• FPC reinforcement
• Pin terminal bonding
• End sealing
• Glass thinning
• Peelable mask
• LOCA (Liquid Optically Clear Adhesive)
• Conductive grounding